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AmDynamic Bond
Kuala Lumpur, Malajsie
AmDynamic Bond, Kuala Lumpur, Malajsie · LEI: 2549005WBI113BDM5R83 · Právní forma: 8888 · Stav: LAPSED. Free company profile — no paywall, no login
FAQ — AmDynamic Bond
- Jaká je LEI AmDynamic Bond?
- The Legal Entity Identifier (LEI) of AmDynamic Bond is 2549005WBI113BDM5R83.
- Kde je AmDynamic Bond registrován?
- AmDynamic Bond má registrovanou adresu v Kuala Lumpur, Malajsie.
- Je výpis z registru AmDynamic Bond zdarma?
- Ano. Eulerpool poskytuje všechna data z firemního rejstříku – včetně kompletního záznamu AmDynamic Bond – zcela zdarma, bez nutnosti přihlášení.
Oficiální matriční záznam
The complete official register extract — every field from the LEI / company register, free of charge, no login required.
| legal_name | AmDynamic Bond |
|---|---|
| legal_city | Kuala Lumpur |
| legal_jurisdiction | MY |
| lei | 2549005WBI113BDM5R83 |
| entity_category | FUND |
| entity_legal_form_code | 8888 |
| legal_first_address_line | 9th Flr Banagunan AmBankGroup |
| legal_additional_address_line | 55 Jalan Raja Chulan |
| legal_postal_code | 50200 |
| headquarters_first_address_line | c/o AmFunds Management Berhad |
| headquarters_additional_address_line | 9th Flr Banagunan AmBankGroup |
| headquarters_city | Kuala Lumpur |
| headquarters_postal_code | 50200 |
| next_renewal_date | 21. 8. 2023 |
| last_update_date | 21. 8. 2023 |
| managing_lou | 5493001KJTIIGC8Y1R12 |
| registration_status | LAPSED |
| validation_sources | ENTITY_SUPPLIED_ONLY |